Breakdown | TTM | Dec 2024 | Dec 2023 | Dec 2022 | Dec 2021 | Dec 2020 |
---|---|---|---|---|---|---|
Income Statement | ||||||
Total Revenue | 1.49B | 1.44B | 1.42B | 1.68B | 1.51B | 1.27B |
Gross Profit | 333.11M | 339.44M | 353.52M | 466.31M | 329.12M | 233.32M |
EBITDA | 487.97M | 451.32M | 851.12M | 594.75M | 437.22M | 331.56M |
Net Income | 196.48M | 207.86M | 518.49M | 264.57M | 150.01M | 82.30M |
Balance Sheet | ||||||
Total Assets | 3.20B | 3.08B | 2.92B | 2.55B | 2.23B | 2.09B |
Cash, Cash Equivalents and Short-Term Investments | 1.21B | 1.22B | 1.24B | 1.01B | 764.65M | 710.88M |
Total Debt | 176.10M | 180.81M | 231.56M | 272.34M | 314.84M | 390.28M |
Total Liabilities | 428.97M | 440.31M | 491.48M | 659.07M | 615.85M | 639.25M |
Stockholders Equity | 2.77B | 2.65B | 2.43B | 1.90B | 1.62B | 1.46B |
Cash Flow | ||||||
Free Cash Flow | -1.06M | 12.53M | 232.06M | 316.28M | 107.48M | -37.09M |
Operating Cash Flow | 443.12M | 448.68M | 676.56M | 529.82M | 421.29M | 276.56M |
Investing Cash Flow | -412.55M | -400.24M | -720.85M | -329.45M | -338.94M | -363.61M |
Financing Cash Flow | -35.48M | -32.45M | -30.41M | -66.65M | -76.86M | -61.19M |
Name | Overall Rating | Market Cap | P/E Ratio | ROE | Dividend Yield | Revenue Growth | EPS Growth |
---|---|---|---|---|---|---|---|
81 Outperform | 9.05B | 41.95 | 19.81% | ― | 43.69% | 51.22% | |
77 Outperform | 6.98B | 28.68 | 14.26% | 1.20% | 6.23% | 10.12% | |
76 Outperform | 7.25B | 23.95 | 7.24% | 2.52% | -1.20% | -19.46% | |
73 Outperform | $7.58B | 39.29 | 7.41% | ― | 7.18% | -60.59% | |
65 Neutral | 5.19B | 261.03 | 4.30% | ― | 22.22% | ― | |
61 Neutral | 7.64B | -84.44 | -13.38% | ― | 65.12% | 15.46% | |
61 Neutral | $37.18B | 12.37 | -10.20% | 1.83% | 8.50% | -7.62% |
On August 13, 2025, Tower Semiconductor announced the launch of its 2025 Technical Global Symposium Series, with events scheduled for September 16 in Shanghai and November 18 in Santa Clara. The symposiums will showcase Tower’s latest technologies and expertise in AI, high-speed connectivity, and other advanced domains, providing networking opportunities with industry leaders and insights into Tower’s capabilities in Silicon Photonics, SiGe, RF SOI, and more. This initiative underscores Tower’s commitment to innovation and strengthening partnerships with customers, potentially enhancing its market position and stakeholder engagement.
On August 12, 2025, Tower Semiconductor and AIStorm introduced the Cheetah HS, the world’s first AI-in-imager chip capable of capturing up to 260,000 frames per second. This innovative chip, designed for applications in inspection, robotics, and sports, combines ultra-high-speed imaging with charge-domain AI to significantly reduce system power requirements and costs. The collaboration leverages Tower’s charge-domain imaging platform and AIStorm’s analog AI neurons, offering a cost-effective solution for a wide range of consumer and industrial applications, marking a significant advancement in the semiconductor industry.
On August 7, 2025, Tower Semiconductor announced its participation in several investor conferences in August and September. These include the Needham 6th Annual Virtual Semiconductor and SemiCap 1×1 Conference, the Jefferies Semiconductor, IT Hardware and Communications Technology Conference, the Evercore ISI 2025 Semiconductor, IT Hardware and Networking Conference, the Benchmark 12th Annual Tech, Media and Telecom 1×1 Conference, and the Jefferies TechTrek 2025 Conference. These events provide opportunities for investors to engage with company representatives, potentially impacting Tower Semiconductor’s visibility and stakeholder engagement.
On August 4, 2025, Tower Semiconductor announced its financial results for the second quarter of 2025, reporting a revenue of $372 million, which marks a 6% increase year-over-year and a 4% rise quarter-over-quarter. The company also highlighted a net profit of $47 million for the quarter. Tower Semiconductor’s strategic initiatives, including the repurposing of factories for increased RF infrastructure capacity, have contributed to its growth, with further revenue increases projected for the third and fourth quarters of 2025. This positions the company strongly within its industry, particularly in the RF infrastructure market, driven by data centers and AI expansions.
On July 30, 2025, Tower Semiconductor announced that it received the Best Supplier Award from Wisol for excellence in RF SOI technology and supply chain support. This recognition highlights Tower’s strong partnership with top-tier vendors and its commitment to delivering stable, timely, and technologically advanced solutions. The award underscores Tower’s position as a trusted global foundry partner, particularly in the mobile, IoT, and automotive markets, where its 300mm RF SOI platform plays a crucial role in producing high-performance RF front-end ICs. The collaboration with Wisol, including support for companies like Samsung Electronics, demonstrates Tower’s ability to meet demanding performance and delivery requirements.
On July 14, 2025, Tower Semiconductor announced its plans to release the second quarter 2025 financial results on August 4, 2025. The company will also host a conference call to discuss these results and provide guidance for the third quarter of 2025. This announcement underscores Tower Semiconductor’s ongoing commitment to transparency and stakeholder engagement, as it continues to position itself as a leader in the analog semiconductor industry.
On July 8, 2025, Tower Semiconductor announced that it, along with pSemi, won the Industry Paper Competition Award at the 2025 IEEE International Microwave Symposium (IMS) for their paper on a low-loss, wideband RF switch. The paper, presented on June 19, 2025, highlights significant advancements in RF switch technology, demonstrating superior bandwidth, insertion loss, power handling, and linearity. This achievement underscores Tower’s leadership in RF front-end innovation and strengthens its position in the market for advanced wireless device integration, benefiting stakeholders by simplifying implementation for 5G, 6G, SatCom, beamforming, and millimeter-wave applications.