| Breakdown | TTM | Dec 2024 | Dec 2023 | Dec 2022 | Dec 2021 | Dec 2020 |
|---|---|---|---|---|---|---|
Income Statement | ||||||
| Total Revenue | 1.51B | 1.44B | 1.42B | 1.68B | 1.51B | 1.27B |
| Gross Profit | 333.10M | 339.44M | 353.52M | 466.31M | 329.12M | 233.32M |
| EBITDA | 504.39M | 451.32M | 847.31M | 590.30M | 433.12M | 335.97M |
| Net Income | 195.48M | 207.86M | 518.49M | 264.57M | 150.01M | 82.30M |
Balance Sheet | ||||||
| Total Assets | 3.25B | 3.08B | 2.92B | 2.55B | 2.23B | 2.09B |
| Cash, Cash Equivalents and Short-Term Investments | 1.22B | 1.22B | 1.24B | 1.01B | 763.87M | 710.10M |
| Total Debt | 164.09M | 180.81M | 231.56M | 272.34M | 314.84M | 390.28M |
| Total Liabilities | 420.02M | 440.31M | 491.48M | 659.07M | 615.85M | 639.25M |
| Stockholders Equity | 2.83B | 2.65B | 2.43B | 1.89B | 1.62B | 1.46B |
Cash Flow | ||||||
| Free Cash Flow | 33.28M | 12.53M | 232.06M | 163.42M | 107.48M | -37.09M |
| Operating Cash Flow | 456.76M | 448.68M | 676.56M | 529.82M | 421.29M | 276.56M |
| Investing Cash Flow | -426.84M | -400.24M | -720.85M | -329.45M | -338.94M | -363.61M |
| Financing Cash Flow | -25.85M | -32.45M | -30.41M | -66.65M | -76.86M | -61.19M |
Name | Overall Rating | Market Cap | P/E Ratio | ROE | Dividend Yield | Revenue Growth | EPS Growth |
|---|---|---|---|---|---|---|---|
76 Outperform | $11.56B | 59.96 | 7.19% | ― | 8.03% | -6.03% | |
75 Outperform | $9.39B | 40.38 | 23.58% | ― | 39.37% | 40.87% | |
73 Outperform | $8.63B | 28.14 | 7.27% | 2.30% | 0.13% | -16.17% | |
69 Neutral | $6.80B | 241.45 | 13.39% | ― | 20.60% | ― | |
63 Neutral | $5.62B | 25.44 | 13.30% | 1.40% | -0.58% | -6.67% | |
61 Neutral | $37.18B | 12.37 | -10.20% | 1.83% | 8.50% | -7.62% | |
51 Neutral | $7.55B | ― | -7.88% | ― | 59.04% | 28.50% |
On November 17, 2025, Tower Semiconductor announced a collaboration with Switch Semiconductor to introduce the SW2001, a high-efficiency buck regulator designed on Tower’s 65nm BCD platform. This product targets applications in servers, AI systems, and telecom infrastructure, promising up to 87% efficiency and reduced emissions. The collaboration marks a significant step in addressing the growing demands of next-generation computing and automation, with sampling set to begin in Q1 2026 and volume production later in the year.
On November 12, 2025, Tower Semiconductor announced the expansion of its 300mm wafer bonding technology to support heterogeneous 3D-IC integration across its Silicon Photonics (SiPho) and SiGe BiCMOS processes. This advancement, supported by Cadence design tools, addresses the demand for compact, high-performance systems in data centers, enabling the integration of application-specific functions into a single high-density chip. The collaboration with Cadence enhances design capabilities, allowing for co-simulation and co-verification of multiple process technologies, thus reinforcing Tower’s leadership in 3D-IC and heterogeneous integration.
On November 10, 2025, Tower Semiconductor announced its financial results for the third quarter of 2025, reporting a revenue of $396 million, a 6% increase from the previous quarter. The company also projected a record revenue of $440 million for the fourth quarter, driven by growth in its core technologies and investments in SiPho and SiGe capacity. Tower Semiconductor is investing an additional $300 million to expand its capabilities and extend its Newport Beach site lease, positioning itself for continued growth amid rising demand in the data center sector.
On October 15, 2025, Tower Semiconductor announced that it will release its third quarter 2025 financial results on November 10, 2025, followed by a conference call to discuss these results and provide guidance for the fourth quarter. The call will be webcast and available on the company’s Investor Relations website, with a replay accessible for 90 days. This announcement highlights Tower Semiconductor’s ongoing commitment to transparency and stakeholder engagement, potentially impacting its market positioning and investor relations.