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Hua Hong Semiconductor Ltd. (HK:1347)
:1347
RESEARCH TOOLSreports
Dividend Data
Last Ex-Dividend Date
Jun 03, 2024Payment date
Jun 26, 2024
Jun 26, 2024
Dividend Amount Per Share
HK$0.165Notavailable
Dividend Yield
0.54%Sector: Technology
Sector Average: 0.664%
Sector Average: 0.664%
Payout Ratio
N/ADividend Growth
12 months Since 2024
Last 3 Months
1347 Dividend History
Ex-Date | Record Date | Payment Date | Frequency | Declaration Date | Amount |
|---|---|---|---|---|---|
Jun 03, 2024 | Jun 04, 2024 | Jun 26, 2024 | Not Available | Mar 28, 2024 | HK$0.17 |
May 14, 2019 | May 15, 2019 | Jun 26, 2019 | Annually | Mar 28, 2019 | HK$0.31 |
May 14, 2018 | May 15, 2018 | Jun 14, 2018 | Annually | Mar 29, 2018 | HK$0.31 |
May 16, 2017 | May 17, 2017 | Jun 16, 2017 | Annually | Mar 29, 2017 | HK$0.30 |
May 13, 2016 | May 16, 2016 | Jun 30, 2016 | Not Available | Mar 25, 2016 | HK$0.27 |
FAQ
Does Hua Hong Semiconductor Ltd. pay dividends?
Yes, HK:1347 has paid a dividend within the past 12 months.
How much is Hua Hong Semiconductor Ltd.'s dividend?
HK:1347 pays a dividend of HK$0.165 per share. HK:1347's annual dividend yield is 0.54%.
When is Hua Hong Semiconductor Ltd. ex-dividend date?
Hua Hong Semiconductor Ltd.'s previous ex-dividend date was on Jun 03, 2024. Hua Hong Semiconductor Ltd. shareholders who own HK:1347 stock before this date received Hua Hong Semiconductor Ltd.'s last dividend payment of HK$0.17 per share on Jun 26, 2024. HK:1347's next ex-dividend date has not been announced yet.
When is Hua Hong Semiconductor Ltd. dividend payment date?
Hua Hong Semiconductor Ltd.’s next quarterly payment date is on Jun 26, 2024, when Hua Hong Semiconductor Ltd. shareholders who owned HK:1347 shares before Jun 03, 2024 received a dividend payment of HK$0.17 per share. Add HK:1347 to your watchlist to be reminded of HK:1347's next dividend payment.
Does Hua Hong Semiconductor Ltd. have sufficient earnings to cover their dividend?
The Hua Hong Semiconductor Ltd. has paid a dividend in the last year and may provide dividends in the near future.