U.S. Government Contract Tranche and Program Expansion
Awarded a $13.0M tranche that begins revenue recognition in Q1; prime U.S. government contract has expanded in scope and is described as a potential $89M program, which materially increases funded backlog and underpins near-term revenue and multi-year opportunity.
SRH (Strategic Radiation Hard) FPGA Test Chip and Dev Kit Demand
Delivered self-funded SRH FPGA test chip (GlobalFoundries 12LP), received samples in Q1 and has orders for SRH FPGA dev kits — positioning QuickLogic as a unique U.S.-fabricated supplier for full-spectrum radiation-hard FPGAs and signaling potential high-value storefront opportunities (management referenced 'hundreds of millions' of potential addressable storefront business).
Near-Term Revenue Upside and Q1 Guidance
Guidance for Q1 revenue of $5.5M ±10% (vs Q4 revenue $3.7M) implying nearly 50% sequential growth; expects $4.5M of new product revenue and $1.0M of mature product revenue in Q1, and models mature product revenue of approximately $4M for full-year 2026.
Technical and IP Momentum (Architectural Enhancements & Intel 18A)
Completed architectural enhancements (improved PPA: lower power, higher performance, reduced area) extensible to 12nm and smaller; completed a 1M LUT feasibility study and delivered multiple Intel 18A engagements — three smaller Intel 18A contracts delivered in 2025 totaling well over $1M with a fourth pending (approaching ~$2M total) and a larger commercial Intel 18A contract worth several million in late-stage discussion.
Commercial Validation and Power Efficiency Win (Epson & Idaho Scientific)
Epson case study integrating QuickLogic eFPGA Hard IP on TSMC e12n reported a 50% reduction in overall SoC power for the targeted functions; Idaho Scientific selected QuickLogic eFPGA Hard IP for hardware cryptographic solutions — evidence of traction beyond defense into commercial secure and low-power applications.
Storefront and Chiplet Program Progress
Planning three MPW tape-outs in 2026 to accelerate storefront offerings (costs for two tape-outs fully covered by customer contracts, third at least partially covered); completed digital chiplet proof-of-concept (POC), presented at Chiplet Summit, and scheduled presentation at Intel Foundry partners’ GOMAC, indicating partner interest and potential channel expansion for eFPGA chiplets and storefront sales.
Improved Near-Term Liquidity Actions
Ended Q4 with $18.8M total cash (inclusive of $15M credit facility) and raised approximately $3.2M via ATM in Q4; management is working to secure a new banking partner and reduce the line of credit from $20M to $10M to lower borrowing costs.