Overshooting Q4 Forecast
The company overshot its fourth-quarter forecast by around ¥2 billion due to higher-than-expected volumes and strong sales of leading edge wafers.
Dividend Payout
The fiscal year-end dividend will be ¥6, bringing the full year DPS to ¥21 with a dividend payout ratio of 39.7%.
Strong Demand for 300mm Wafers
Continued recovery in demand for 300mm wafers in Q4, led by AI data center applications.
R&D and Technological Advancements
The company is investing in R&D for leading-edge technologies such as 3D structures and wafer bonding, which are crucial for future growth in AI and memory applications.
CapEx and Infrastructure Investments
Significant capital expenditures of ¥214.9 billion, reflecting investments in new plants and infrastructure to support future growth.