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TI Cloud Inc. (HK:2167)
:2167
Hong Kong Market
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TI Cloud Inc. (2167) Dividend Date & History

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Dividend Data

Dividend Data
Next Ex-Dividend Date
Jun 05, 2026
Payment date​
Jul 03, 2026
Dividend Amount Per Share
HK$0.1
Notavailable
Dividend Yield
2.12%
Sector: Technology
Sector Average: 1.033%
Payout Ratio
Dividend Growth​
11 months
Since 2025
Last 3 Months

Dividend Amount Per Share​

2167 Dividend History

Ex-Date
Record Date
Payment Date
Frequency
Declaration Date
Amount
Jun 05, 2026
Jun 09, 2026
Jul 03, 2026
AnnuallyHK$0.10
Jun 05, 2025
Jun 06, 2025
Jul 03, 2025
SpecialHK$0.10
The table shows TI Cloud Inc.’s dividend history, including amount per share, payout frequency, declaration, record, and payment dates.

FAQ

Does TI Cloud Inc. pay dividends?
Yes, HK:2167 has paid a dividend within the past 12 months.
    How much is TI Cloud Inc.'s dividend?
    HK:2167 pays a dividend of HK$0.1 per share. HK:2167's annual dividend yield is 2.12%.
      When is TI Cloud Inc. ex-dividend date?
      TI Cloud Inc.'s upcoming ex-dividend date is on Jun 05, 2026. TI Cloud Inc. shareholders who own HK:2167 stock before this date will receive TI Cloud Inc.'s next dividend payment of HK$0.1 per share on Jul 03, 2025. Add HK:2167 to your watchlist to be reminded before TI Cloud Inc.'s ex-dividend date.
        When is TI Cloud Inc. dividend payment date?
        TI Cloud Inc.'s next quarterly payment date is on Jul 03, 2025, when TI Cloud Inc. shareholders who owned HK:2167 shares before Jun 05, 2025 received a dividend payment of HK$0.1 per share. Add HK:2167 to your watchlist to be reminded of HK:2167's next dividend payment.
          Does TI Cloud Inc. have sufficient earnings to cover their dividend?
          The TI Cloud Inc. has paid a dividend in the last year and may provide dividends in the near future.