| Breakdown | TTM | Dec 2024 | Dec 2023 | Dec 2022 | Dec 2021 | Dec 2020 |
|---|---|---|---|---|---|---|
Income Statement | ||||||
| Total Revenue | 2.43B | 2.52B | 2.26B | 2.04B | 1.63B | 1.14B |
| Gross Profit | 444.42M | 467.31M | 434.70M | 375.52M | 296.56M | 260.76M |
| EBITDA | 150.68M | 181.46M | 243.18M | 121.98M | 100.62M | 75.68M |
| Net Income | -54.82M | 42.19M | 69.70M | 63.60M | 71.30M | 61.30M |
Balance Sheet | ||||||
| Total Assets | 5.24B | 4.67B | 4.25B | 2.54B | 2.48B | 2.23B |
| Cash, Cash Equivalents and Short-Term Investments | 1.31B | 891.55M | 1.21B | 1.13B | 1.03B | 1.35B |
| Total Debt | 1.77B | 1.50B | 1.02B | 235.25M | 331.10M | 280.10M |
| Total Liabilities | 2.96B | 2.32B | 1.51B | 653.51M | 690.28M | 495.37M |
| Stockholders Equity | 1.49B | 1.56B | 1.93B | 1.86B | 1.79B | 1.73B |
Cash Flow | ||||||
| Free Cash Flow | -1.12M | -2.23M | 297.36M | 403.91M | -333.43M | 358.59M |
| Operating Cash Flow | 10.61M | 21.23M | 321.14M | 461.16M | -312.83M | 376.00M |
| Investing Cash Flow | -32.91M | -65.82M | -438.89M | -38.06M | -59.63M | -63.26M |
| Financing Cash Flow | -18.74M | -37.49M | 236.31M | -118.22M | 17.97M | -27.98M |
Name | Overall Rating | Market Cap | P/E Ratio | ROE | Dividend Yield | Revenue Growth | EPS Growth |
|---|---|---|---|---|---|---|---|
63 Neutral | HK$130.90M | 5.72 | 3.56% | ― | 8.78% | 160.00% | |
61 Neutral | $37.18B | 12.37 | -10.20% | 1.83% | 8.50% | -7.62% | |
61 Neutral | HK$162.62M | 2.49 | 7.40% | ― | -9.34% | 605.26% | |
58 Neutral | HK$633.22M | -10.72 | -3.08% | ― | 5.24% | -201.60% | |
52 Neutral | €360.00M | -473.68 | -0.09% | ― | -23.93% | -109.41% | |
45 Neutral | HK$539.85M | -21.03 | -0.68% | ― | 6.88% | -49.48% | |
41 Neutral | HK$121.99M | -0.93 | -29.56% | ― | -12.03% | -40.38% |
Hengxin Technology Ltd. announced a further delay in the dispatch of a circular related to its New Purchases and Sales Master Agreements, originally expected by November 21, 2025. The delay, now extended to December 19, 2025, is due to the need for additional time to finalize certain information, impacting the company’s compliance timeline with the Listing Rules and potentially affecting shareholder communications.
Hengxin Technology Ltd. announced a delay in the dispatch of a circular related to its New Purchases Master Agreement and New Sales Master Agreement. Initially planned for release by 21 November 2025, the circular will now be dispatched by 5 December 2025 due to the need for additional time to finalize certain information. This delay may impact the company’s stakeholders as it involves important details and advice from the Independent Board Committee and Financial Adviser.
Hengxin Technology Ltd. has announced the revision and renewal of annual caps for its continuing connected transactions involving purchases and sales agreements with Hengtong Group and Hengtong Optic-Electric. The company has entered into new master agreements to accommodate the anticipated increase in transaction volumes through 2026. These agreements are subject to regulatory requirements due to their scale, and the company will seek approval from independent shareholders, excluding votes from Mr. Cui Wei and his associates, at an upcoming extraordinary general meeting.
Hengxin Technology Ltd. has announced that its subsidiary, Zhejiang Zhongguang New Energy Technology Co., Ltd., has entered into a loan agreement worth RMB200 million with Exim New-Type Policy Financial Instruments Co., Ltd. This loan will support the capital needs of the Delingha 350MW tower-based solar thermal power project in Qinghai Province, China. The project is expected to enhance the company’s position in the solar thermal power sector by providing stable and reliable clean energy to the Qinghai grid. The loan aligns with Hengxin’s renewable energy strategy and is anticipated to generate stable long-term revenue, boosting the company’s market reputation and competitiveness.
Hengxin Technology Ltd. has announced the establishment of a Joint Laboratory for Intelligent Security Cryptographic Chips in collaboration with East China Normal University. This initiative aims to advance the industrialization of cryptographic chips by developing proprietary cryptographic algorithms and security chips, particularly in the field of post-quantum cryptography. The collaboration is expected to enhance Hengxin’s capabilities in foundational research and key technology breakthroughs, thereby strengthening its competitiveness in the digital security sector.