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Time Interconnect Technology Limited (HK:1729)
:1729
Hong Kong Market

Time Interconnect Technology Limited (1729) Dividend Date & History

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Dividend Data

Next Ex-Dividend Date
May 27, 2025
Payment date​
Jun 26, 2025
Dividend Amount Per Share
HK$0.013
Annually
Dividend Yield
0.59%
Sector: Industrials
Sector Average: 1.415%
Payout Ratio
3.02%
Dividend Growth​
2 years
Since 2022
Last 3 Months

Dividend Amount Per Share​

1729 Dividend History

Ex-Date
Record Date
Payment Date
Frequency
Declaration Date
Amount
May 27, 2025May 28, 2025Jun 26, 2025AnnuallyMar 28, 2025HK$0.01
Sep 10, 2024Sep 11, 2024Oct 09, 2024AnnuallyAug 28, 2024<HK$0.01
May 31, 2024Jun 03, 2024Jun 28, 2024AnnuallyMar 28, 2024<HK$0.01
Dec 08, 2023Dec 11, 2023Jan 09, 2024AnnuallyNov 27, 2023<HK$0.01
Aug 30, 2023Aug 31, 2023Sep 26, 2023AnnuallyJun 28, 2023<HK$0.01
Dec 12, 2022Dec 13, 2022Jan 11, 2023AnnuallyNov 29, 2022<HK$0.01
Aug 25, 2022Aug 26, 2022Sep 22, 2022AnnuallyJun 28, 2022<HK$0.01
Dec 10, 2021Dec 13, 2021Jan 07, 2022AnnuallyNov 29, 2021<HK$0.01
Aug 25, 2021Aug 26, 2021Sep 21, 2021AnnuallyJun 28, 2021HK$0.01
Dec 10, 2020Dec 11, 2020Jan 08, 2021AnnuallyNov 27, 2020HK$0.01
The table shows Time Interconnect Technology Limited’s dividend history, including amount per share, payout frequency, declaration, record, and payment dates.

FAQ

Does Time Interconnect Technology Limited pay dividends?
Yes, HK:1729 has paid a dividend within the past 12 months.
    How much is Time Interconnect Technology Limited's dividend?
    HK:1729 pays a dividend of HK$0.013 per share. HK:1729's annual dividend yield is 0.59%.
      When is Time Interconnect Technology Limited ex-dividend date?
      Time Interconnect Technology Limited's upcoming ex-dividend date is on May 27, 2025. Time Interconnect Technology Limited shareholders who own HK:1729 stock before this date will receive Time Interconnect Technology Limited's next dividend payment of HK$0.01 per share on Jun 26, 2025. Add HK:1729 to your watchlist to be reminded before Time Interconnect Technology Limited's ex-dividend date.
        When is Time Interconnect Technology Limited dividend payment date?
        Time Interconnect Technology Limited's next dividend payment date is on Jun 26, 2025, when Time Interconnect Technology Limited shareholders who own HK:1729 shares before May 27, 2025 will receive a dividend payment of HK$0.01 per share. Add HK:1729 to your watchlist to be reminded of HK:1729's next dividend payment.
          Does Time Interconnect Technology Limited have sufficient earnings to cover their dividend?
          Yes, HK:1729's past year earnings per share was HK$0.13, and their annual dividend per share is HK$0.01. HK:1729's dividend payout ratio is 3.02% (HK$0.01/HK$0.13) which is sustainable.
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