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Time Interconnect Technology Limited (HK:1729)
:1729
Hong Kong Market

Time Interconnect Technology Limited (1729) Dividend Date & History

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Dividend Data

Dividend Data
Next Ex-Dividend Date
Jun 02, 2026
Payment date​
Jun 26, 2026
Dividend Amount Per Share
HK$0.016
Quarterly
Dividend Yield
0.17%
Sector: Industrials
Sector Average: 1.17%
Payout Ratio
5.54%
Dividend Growth​
2 years
Since 2024
Last 3 Months

Dividend Amount Per Share​

1729 Dividend History

Ex-Date
Record Date
Payment Date
Frequency
Declaration Date
Amount
Jun 02, 2026
Jun 04, 2026
Jun 26, 2026
Semi AnnuallyHK$0.02
Sep 10, 2025
Sep 11, 2025
Oct 09, 2025
QuarterlyHK$0.02
May 27, 2025
May 28, 2025
Jun 26, 2025
SpecialHK$0.01
Sep 10, 2024
Sep 11, 2024
Oct 09, 2024
QuarterlyHK$0.01
May 31, 2024
Jun 03, 2024
Jun 28, 2024
Semi Annually<HK$0.01
Dec 08, 2023
Dec 11, 2023
Jan 09, 2024
Semi Annually<HK$0.01
Aug 30, 2023
Aug 31, 2023
Sep 26, 2023
Special<HK$0.01
Dec 12, 2022
Dec 13, 2022
Jan 11, 2023
Quarterly<HK$0.01
Aug 25, 2022
Aug 26, 2022
Sep 22, 2022
SpecialHK$0.01
Dec 10, 2021
Dec 13, 2021
Jan 07, 2022
QuarterlyHK$0.01
The table shows Time Interconnect Technology Limited’s dividend history, including amount per share, payout frequency, declaration, record, and payment dates.

FAQ

Does Time Interconnect Technology Limited pay dividends?
Yes, HK:1729 has paid a dividend within the past 12 months.
    How much is Time Interconnect Technology Limited's dividend?
    HK:1729 pays a dividend of HK$0.016 per share. HK:1729's annual dividend yield is 0.17%.
      When is Time Interconnect Technology Limited ex-dividend date?
      Time Interconnect Technology Limited's upcoming ex-dividend date is on Jun 02, 2026. Time Interconnect Technology Limited shareholders who own HK:1729 stock before this date will receive Time Interconnect Technology Limited's next dividend payment of HK$0.02 per share on Oct 09, 2025. Add HK:1729 to your watchlist to be reminded before Time Interconnect Technology Limited's ex-dividend date.
        When is Time Interconnect Technology Limited dividend payment date?
        Time Interconnect Technology Limited's next quarterly payment date is on Oct 09, 2025, when Time Interconnect Technology Limited shareholders who owned HK:1729 shares before Sep 10, 2025 received a dividend payment of HK$0.02 per share. Add HK:1729 to your watchlist to be reminded of HK:1729's next dividend payment.
          Does Time Interconnect Technology Limited have sufficient earnings to cover their dividend?
          The Time Interconnect Technology Limited has paid a dividend in the last year and may provide dividends in the near future.