Record Quarter and Strong Financial Performance
Q1 net sales of $1.3B, up 18% year-over-year and 11% sequentially; organic sales +17% YoY. Adjusted operating EBITDA of $411M, up 22% YoY, with adjusted EBITDA margin 31.3% (expanded >125 bps YoY). Adjusted EPS was $1.08, up 33% YoY. Cash and short-term investments ~ $850M; repurchased $25M of shares.
Raised Full-Year Guidance
Management raised FY26 guidance: net sales $5.225B–$5.375B (midpoint +5%), adjusted operating EBITDA $1.535B–$1.625B (midpoint +4%), adjusted EPS $3.80–$4.14 (midpoint +6%), and adjusted free cash flow $500M–$600M (midpoint +10%). Company expects double-digit net sales and EBITDA growth year-over-year and now models MSI wafer start growth in the mid- to high-single-digit range.
Interconnect Solutions (ICS) Outperformance
ICS net sales $593M with organic growth +22% YoY. Core ICS areas (Advanced Packaging, Interconnects, Thermal Management) grew >50% YoY. ICS adjusted operating EBITDA margin 28.5%, improving ~280 bps sequentially, driven by operating leverage and favorable mix; winning new business with AI PCB fabs, hyperscalers and premium OEMs.
Semiconductor Technologies Growth and Node Momentum
Semiconductor net sales $722M with organic growth +12% YoY, led by advanced logic and HBM. CMP and lithography product lines saw strength as 3nm volumes scale and early 2nm activity appears; segment adjusted operating EBITDA margin 36.4%, up ~130 bps sequentially.
Strategic Partnerships and Capacity Expansion
Announced collaboration with NVIDIA on materials R&D and inclusion in Apple's American manufacturing program. Opened a 385,000 sq. ft. Delaware facility; announced a new Taiwan site (to be fully operational early 2027). CapEx elevated to support capacity (FY26 ~9% of sales) with modular investments to enable customer ramps.
Persistent Innovation and Commercial Traction
Eighth consecutive quarter of profitable organic growth with multiple process-of-record (POR) wins across product lines. R&D focus on advanced nodes (3nm, 2nm and Angstrom-era 16/14/10), CMP consumables, lithography films/EUV sublayers, AI PCBs and thermal management is translating into share gains and visible multi-year demand.