Strong TCB Momentum
The company reported strong momentum in its Thermal Compression Bonding (TCB) solutions, particularly for High Bandwidth Memory (HBM). A significant bulk TCB order was received from a leading global HBM player in October, with expectations for continued demand into 2025.
Improved Gross Margin
The group's gross margin improved by 94 basis points quarter-on-quarter and by 683 basis points year-on-year, driven by higher manufacturing utilization due to TCB production ramp.
Positive Book-to-Bill Ratio
The SEMI segment had a book-to-bill ratio of 1.04 in Q3, remaining above 1 since Q1 2024, with SEMI bookings showing a strong year-on-year growth of 40.1%.
AP and Mainstream Business Balance
Advanced Packaging (AP) solutions continue to show robust booking, with strong demand from generative AI and high-performance computing applications helping to mitigate mainstream business weakness.
Strategic Joint Venture Disposal
The group proposed to dispose of a stake in its joint venture, Advanced Assembly Materials International Line (AAMI), potentially creating additional value for shareholders.