Strong Revenue Growth
Q1 2026 revenue of EUR 184.9 million, up 28.3% versus Q1 2025 driven by higher shipments for high-end mobile and 2.5D AI photonics and data center applications.
Record Orders and Hybrid Bonding Momentum
Q1 2026 orders of EUR 269.7 million — more than doubled year-over-year versus Q1 2025 and rose 7.7% versus Q4 2025. Unit orders for hybrid bonding more than doubled versus Q4 2025 and exceeded the prior quarterly peak (Q2 2024); hybrid bonding customer count increased to 20.
Improved Profitability and Margins
Net income rose 63.8% versus Q1 2025 and 20.6% versus Q4 2025. Net margin expanded to 27.9% from 21.9% in Q1 2025. Gross margin was 63.5% in Q1 2026, with management expecting gross margins of 64%–66% in Q2 2026.
Strong Cash Generation and Balance Sheet Improvement
Net cash grew to EUR 103.3 million, up 186.9% versus Q4 2025. Cash flow from operations was EUR 93 million in Q1 2026 — more than double the comparable prior-year period.
Active Capital Allocation
Share repurchases of approximately EUR 14.2 million in Q1 2026 (EUR 25.5 million total repurchased under a EUR 60 million program) demonstrating return-of-capital activity alongside growth investments.
Positive Forward Guidance
Management guided Q2 2026 revenue growth of 30%–40% versus Q1 2026 and H1 2026 revenue expected to increase ~49% versus H1 2025 (midpoint assumption). Anticipated significant net income and margin expansion in Q2 and H1 2026.
Product Adoption and Customer Wins
Shipments of evaluation tools: 2 evaluation tools shipped to a second memory customer (now 3 memory customers evaluating HBM hybrid bonding). TC Next adoption increased to 6 customers. Notable adoption signals from logic and memory customers and public confirmations (e.g., Apple M5, AMD, Broadcom, Samsung disclosures).
Capacity Expansion and Operational Readiness
Theoretical hybrid bonder production capacity discussed: ~15 bonders/month (~180/year) expandable to ~250/year with increased floor space and operational adjustments. Lead time for current models cited around 6 months for 100 nm-class systems. Plans to add Vietnamese mainstream assembly capacity and free up Malaysia for wafer-level assembly; increased service presence in Taiwan and Korea.
Service Revenue Upside
Service revenues historically ~15% of group revenue; management expects service intensity to rise toward ~18%–20% (front-end-like levels) as hybrid bonding installed base and high-touch support needs increase. Service described as a margin tailwind.