Strong Q4 Revenue and Orders Momentum
Q4 revenue of EUR 166.4 million (+25.4% vs Q3 2025) and Q4 orders of EUR 250.4 million (+43.3% vs Q3 2025), driven by broad-based demand from Asian subcontractors for 2.5D data center applications, renewed photonics capacity purchases and a large increase in hybrid bonding orders.
Full-Year Orders Growth and H2 Acceleration
Full-year orders of EUR 685 million, up 16.8% vs 2024. Order momentum accelerated in H2 2025 with orders up 63.6% vs H1 2025. AI-related orders comprised ~50% of total orders in 2025.
Healthy Profitability and Margins
Maintained attractive profitability in 2025 with gross margin ~63.3%, operating margin ~29.3% and net margin ~22.3%. Net income for Q4 was EUR 42.8 million (+69.2% vs Q3 2025) reflecting higher revenue, improved product mix and controlled opex growth.
Strong Liquidity and Capital Returns
Year-end cash and deposits of EUR 543 million and net cash of EUR 36 million (increases vs Sep 30, 2025 of EUR 24.4 million and EUR 43.8 million, respectively). Proposed cash dividend EUR 1.58 per share (95% payout ratio). Distributed EUR 254.8 million in dividends and buybacks in 2025.
Significant Progress in Hybrid Bonding Adoption
Hybrid bonding adoption expanded to 18 customers with cumulative orders >150 systems. Installed 6 integrated hybrid bonding production lines at a leading logic customer incorporating 30 Besi hybrid bonders in collaboration with Applied Materials. First 15-nanometer placement accuracy prototype completed and available for customer qualification.
Progress on TC NXT and Product Portfolio
TC NXT adoption expanded to 5 customers (logic, memory and photonics). Flip chip and multi-module die attach systems gained share in AI-related 2.5D assembly. Introduced next-generation die bonding and packaging systems across mainstream markets preparing for recovery.
Positive 2026 Guidance and Market Outlook
Entered 2026 with optimism: Q1 2026 revenue guidance +5% to +15% vs Q4 2025; anticipated gross margins 63%–65%; planned opex increase 10%–15% to support development. Management expects growth drivers from 3D wafer-level assembly, AI-related 2.5D capacity and mainstream assembly recovery.
Increased Exposure to AI and Data Center Demand
Revenue mix shifted toward computing: computing end-user market grew from ~40% of revenue in 2024 to ~50% in 2025. Management cites capacity shortages in 2.5D packaging and multiple new advanced packaging fabs planned globally as demand drivers.