ChipMOS Technologies (CPIA) Price & Analysis

ChipMOS Technologies Ltd. released its earnings results on Nov 12, 2025. The company reported €0.275 earnings per share for the quarter, beating the consensus estimate of €0.091 by €0.183.

Is ChipMOS Technologies Ltd. overvalued?

According to Wall Street analysts ChipMOS Technologies Ltd.’s price is currently Overvalued. Get more investment ideas with TipRanks Premium

Does ChipMOS Technologies Ltd. pay dividends?

ChipMOS Technologies Ltd. pays a Annually dividend of €0.72 which represents an annual dividend yield of 3%. See more information on ChipMOS Technologies Ltd. dividends here

What is ChipMOS Technologies Ltd.’s EPS estimate?

ChipMOS Technologies Ltd.’s EPS estimate is 0.29.

How many shares outstanding does ChipMOS Technologies Ltd. have?

ChipMOS Technologies Ltd. has 35,226,160 shares outstanding.

What happened to ChipMOS Technologies Ltd.’s price movement after its last earnings report?

ChipMOS Technologies Ltd. reported an EPS of €0.275 in its last earnings report, beating expectations of €0.091. Following the earnings report the stock price went up 8.995%.

Which hedge fund is a major shareholder of ChipMOS Technologies Ltd.?

Currently, no hedge funds are holding shares in DE:CPIA

What is the TipRanks Smart Score and how is it calculated?

Smart Score combines eight research factors - such as analyst recommendations, hedge fund trends, and technical indicators - to measure a stock’s outlook. These signals are unified into a single score that reflects bullish or bearish momentum. See detailed methodology

ChipMOS Technologies Stock Smart Score

Neutral

Blogger Sentiment

Bullish

DE:CPIA Sentiment 70%
Sector Average ―

Technicals

Fundamentals

Return on Equity

0.98%

Trailing 12-Months

Asset Growth

-1.54%

Trailing 12-Months

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Company Description

ChipMOS Technologies Ltd.

ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. The company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.