Texas Instruments outlines plan to invest $60B in U.S.

Texas Instruments (TXN) announced its plans to invest more than $60Bacross seven U.S. semiconductor fabs. Working with the Trump administration and building on the company’s nearly 100-year legacy, TI said is expanding its U.S. manufacturing capacity to supply the growing need for semiconductors that will advance critical innovations from vehicles to smartphones to data centers. Combined, TI’s new manufacturing mega-sites in Texas and Utah will support more than 60,000 U.S. jobs. “TI is building dependable, low-cost 300mm capacity at scale to deliver the analog and embedded processing chips that are vital for nearly every type of electronic system,” said Haviv Ilan, president and CEO of Texas Instruments. “Leading U.S. companies such as Apple, Ford, Medtronic, NVIDIA and SpaceX rely on TI’s world-class technology and manufacturing expertise, and we are honored to work alongside them and the U.S. government to unleash what’s next in American innovation.” SM1, TI’s first new fab in Sherman will begin initial production this year, just three years after breaking ground. Construction is also complete on the exterior shell of SM2, TI’s second new fab in Sherman. Incremental investment plans include two additional fabs, SM3 and SM4, to support future demand. TI is ramping LFAB1, the company’s first 300mm wafer fab in Lehi. Construction is also well underway on LFAB2, TI’s second Lehi fab that will connect to LFAB1. TI’s second fab in Richardson, RFAB2, continues to ramp to full production.