Synopsys (SNPS) announced “major advances” in silicon-proven IP, AI-powered EDA flows, and system-level enablement across TSMC’s (TSM) most advanced processes and packaging technology nodes, including the TSMC 3nm and 2nm families, as well as A16 with Super Power Rail and A14. “TSMC’s most advanced process and packaging technologies are opening new frontiers for performance, bandwidth, and energy efficiency in AI and autonomous systems. Through our deep collaboration, Synopsys is delivering AI-driven design flows, advanced multiphysics signoff, and a comprehensive portfolio of proven interface and foundation IP that help customers accelerate innovation and achieve outstanding quality of results,” said Michael Buehler-Garcia, Senior Vice President at Synopsys.
Claim 30% Off TipRanks
- Unlock hedge fund-level data and powerful investing tools for smarter, sharper decisions
- Discover top-performing stock ideas and upgrade to a portfolio of market leaders with Smart Investor Picks
Published first on TheFly – the ultimate source for real-time, market-moving breaking financial news. Try Now>>
Read More on SNPS:
- Synopsys Shareholders Approve Amended Equity Incentive Plan
- AI Boom Forces BofA to Lift Chip Industry Outlook by $300 Billion
- Synopsys management to meet with KeyBanc
- NVDA Stock Forecast: Why Nvidia Is Building Stakes in Chip Makers
- Marvell Stock (MRVL) Soars 13% as Nvidia Tie-Up Supports “Continued Strong Growth”