Synopsys (SNPS) announced “major advances” in silicon-proven IP, AI-powered EDA flows, and system-level enablement across TSMC’s (TSM) most advanced processes and packaging technology nodes, including the TSMC 3nm and 2nm families, as well as A16 with Super Power Rail and A14. “TSMC’s most advanced process and packaging technologies are opening new frontiers for performance, bandwidth, and energy efficiency in AI and autonomous systems. Through our deep collaboration, Synopsys is delivering AI-driven design flows, advanced multiphysics signoff, and a comprehensive portfolio of proven interface and foundation IP that help customers accelerate innovation and achieve outstanding quality of results,” said Michael Buehler-Garcia, Senior Vice President at Synopsys.
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