STMicroelectronics (STM) is now entering high-volume production for its silicon photonics-based PIC100 platform used by hyperscalers for optical interconnect for data centers and AI clusters. The 800G and 1.6T PIC100 transceivers enable higher bandwidth, lower latency, and greater energy efficiency as AI workloads surge. “Following the announcement of its new silicon photonics technology in February 2025, ST is now entering high-volume production for leading hyperscalers. The combination of our technology platform and the superior scale of our 300 mm manufacturing lines gives us a unique competitive advantage to support the AI infrastructure super-cycle,” said Fabio Gualandris, president, quality, manufacturing and technology, STMicroelectronics. “Looking ahead, we are planning and executing on capacity expansions to enable more than quadrupling of production by 2027. This fast expansion is fully underpinned by customers’ long-term capacity reservation commitments.”
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