Hyundai Mobis (HYMTF) and Qualcomm (QCOM) announced that the companies have signed a comprehensive agreement an at CES 2026 to co-develop next generation solutions for Software-Defined Vehicle and Advanced Driver Assistance Systems. They said: “Through this collaboration, Hyundai Mobis and Qualcomm Technologies will jointly develop integrated solutions tailored for emerging markets while pursuing broader global supply opportunities by leveraging the combination of Hyundai Mobis’s expertise in system integration, sensor fusion, and perception with Qualcomm Technologies’ leadership in system-on-chip technology.” The companies will begin their work with their co-development of advanced driving and parking solutions based on the Snapdragon Ride Flex system-on-ship.
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