Reports Q3 revenue $218.193M, consensus $218.69M. “The qualification of the 3Di technology for 3D bump metrology by two customers supporting HBM and another customer supporting 2.5D logic applications for AI is another great step forward by the Onto Innovation (ONTO) team in advancing our leadership in advanced packaging process control,” said Michael Plisinski, chief executive officer of Onto Innovation. “With several of our next generation Dragonfly systems for high resolution 2D applications expected to begin shipping in the next few weeks, we are delivering the comprehensive solutions our customers need, not only to control processes today, but also for their next generation technologies.”
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