Multibeam raises $31M in Series B funds

Multibeam has raised $31M in Series B funds from global investors led by Onto Innovation (ONTO) and Lam Capital, the venture capital arm of Lam Research Corp. (LRCX). Participants also include UMC Capital, the venture capital arm of UMC (UMC), and MediaTek Capital, the venture capital arm of MediaTek. Several leading financial and corporate investors also contributed to the oversubscribed round, alongside existing investors. Multibeam will use the proceeds to accelerate development of its next-generation multi-column E-Beam Lithography platform for 300mm wafer and panel-level maskless lithography. The funds will also be used to develop applications that enable silicon innovations to meet the lower-energy and higher-performance demands of artificial intelligence and related technologies, which require advanced packaging and integration of semiconductors, as well as rapid development and time-to-market of new chip technologies and designs. Multibeam’s platform offers a powerful, production-grade tool that provides full-wafer field of view, exceptional depth of focus, maskless writing, and the ability to write unique patterns. These capabilities will unleash new frontiers in chip design for quantum computing, photonics, MEMS, compound semiconductors and power devices.