Micron ships customer samples of 256GB SOCAMM2 module

Micron (MU) Technology began shipping customer samples of the industry’s highest-capacity LPDRAM module – 256GB SOCAMM2. Enabled by the industry’s first monolithic 32Gb LPDDR5X design, this milestone represents a transformational step forward for AI data centers, delivering low-power memory capacity that can unlock new system architectures. “Micron’s 256GB SOCAMM2 offering enables the most power-efficient CPU-attached memory solution for both AI and HPC. Today’s announcement highlights Micron’s technology and packaging advancements to deliver the highest-capacity, lowest-power modular memory solution with the smallest footprint in the industry,” said Raj Narasimhan, senior vice president and general manager of Micron’s Cloud Memory Business Unit. “Our continued leadership in low-power memory solutions for data center applications has uniquely positioned us to be the first to deliver a 32Gb monolithic LPDRAM die, helping drive industry adoption of more power-efficient, high-capacity system architectures.”