Micron (MU) Technology announced customer sampling of 192GB SOCAMM2 to enable broader adoption of low-power memory within AI data centers. SOCAMM2 extends the capabilities of Micron’s first-to-market LPDRAM SOCAMM, delivering 50% more capacity in the same compact footprint. The added capacity can significantly reduce time to first token by more than 80% in real-time inference workloads. The 192GB SOCAMM2 uses Micron’s most advanced 1-gamma DRAM process technology to deliver greater than 20% improvement in power efficiency, further enabling power design optimization of large data center clusters. These savings become quite significant in full-rack AI installations, which can include more than 40 terabytes of CPU-attached low-power DRAM main memory. The modular design of SOCAMM2 improves serviceability and lays the groundwork for future capacity expansion.
Elevate Your Investing Strategy:
- Take advantage of TipRanks Premium at 50% off! Unlock powerful investing tools, advanced data, and expert analyst insights to help you invest with confidence.
Published first on TheFly – the ultimate source for real-time, market-moving breaking financial news. Try Now>>
Read More on MU:
- AI Chip Boom Triggers Global Memory Shortage, Lifting Prices for Samsung, SK Hynix, and Micron
- Micron Announces Board Member Retirements
- Crucial debuts DDR5 Pro Overclocking 6400 CL32 Gaming DRAM
- China’s CXMT Targets $42B Shanghai IPO to Challenge Global Chip Giants
- Mixed options sentiment in Micron with shares up 2.33%