Deca Technologies and Silicon Storage Technology, a subsidiary of Microchip (MCHP) Technology, announced that they have entered into a strategic agreement to innovate a comprehensive non-volatile memory, NVM, chiplet package to facilitate customer adoption of modular, multi-die systems. This collaboration combines Deca’s M-Series fan-out and Adaptive Patterning technologies with SST’s SuperFlash embedded flash technology. The collaborative solution provides a modular, memory-centric foundation for advanced multi-die architectures by combining the strengths of both companies.
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