Microchip announces BZPACK mSiC power modules

Microchip (MCHP) Technology announces its BZPACK mSiC power modules, designed to meet stringent High Humidity High Voltage High Temperature Reverse Bias standards.The BZPACK modules can deliver exceptional reliability, streamline manufacturing and offer versatile system-integration options for the most demanding power-conversion environments. Available in a wide range of topologies, including half-bridge, full-bridge, three-phase and PIM/CIB configurations, providing designers with the flexibility to optimize for performance, cost and system architecture. Tested to meet HV-H3TRB standards that exceed the 1,000-hour standard, the BZPACK mSiC power modules provide confidence for deployments in industrial and renewable energy applications. With a Comparative Tracking Index 600V case, stable Rds(on) across temperature ranges and substrate options in Aluminum Oxide or Aluminum Nitride, the modules provide superior insulation, thermal management and long-term durability.