Lightwave Logic (LWLG) announced the launch of a technical program with a new Fortune Global 500 Company aimed at Co-Packaged Optics applications. Throughout the first half of 2026, Lightwave Logic intends to develop a custom variant of its Perkinamine electro-optic polymer material optimized for the stringent manufacturing conditions of AI scale-up and scale-out where silicon photonics chips are co-packaged with EICs and ASICs. In addition, Lightwave Logic intends to co-develop with its partner a technical solution optimized for 400Gb/s CPO applications. This collaboration will extend across multiple technical areas such as high-speed modulator simulation and design, product testing, packaging and assembly processes and the associated Process Design Kit for electro-optic polymer integration into standard silicon photonics foundry process. The goal of this program is to also demonstrate that electro-optic polymers can deliver high yield products, scale to high volume production while being fully compatible with new processes and packaging tools being developed by the semiconductor industry.
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