Lam Research (LRCX) “unveiled VECTOR(R) TEOS 3D, a breakthrough deposition tool engineered specifically for the advanced packaging of next-generation chips required for artificial intelligence and high-performance computing applications. TEOS 3D is purpose-built to solve critical challenges in 3D stacking and high-density heterogeneous integration. It provides ultra-thick, uniform, inter-die gapfill, leveraging a proprietary bowed wafer handling approach, innovations in dielectric deposition, and enhanced monitoring by Lam Equipment Intelligence technology. TEOS 3D is installed at leading logic and memory fabs around the world.”
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