Interlink enters non-binding letter of intent for potential acquisition

Interlink Electronics (LINK) announced that it has entered into a non-binding letter of intent for a potential strategic acquisition. The proposed acquisition target is a provider of manufacturing solutions to customers operating in sectors, including semiconductor, defense, laser and photonics, commercial high-tech, and aerospace. Based on information made available to the company by the proposed target, the target generated more than $33M in revenue and approximately $4M in EBITDA for 2025. The company currently expects that, if the proposed transaction is consummated, the consideration would be financed through a combination of indebtedness incurred by the company and the issuance of equity securities by the company to the sellers, with the equity valued based on the prevailing market price at the time of closing subject to a minimum price of $5.00 per share and a maximum price of $10.00 per share. The final financing structure, however, remains subject to ongoing evaluation, negotiation, and definitive documentation. The LOI is non-binding, and any transaction would remain subject to, among other things, completion of satisfactory due diligence, negotiation and execution of definitive agreements, the agreement of final transaction terms, the availability of financing on acceptable terms, required board, regulatory and third-party approvals, if applicable, and the satisfaction or waiver of conditions to closing customary for transactions of this nature. The parties may terminate discussions at any time, and there can be no assurance that definitive agreements will be entered into or that any transaction contemplated by the LOI will be completed on the terms currently contemplated or at all. Any final transaction terms may differ materially from those reflected in the LOI.