IBM and Tokyo Electron extend research and development agreement

IBM (IBM) and Tokyo Electron, or TEL, announced an extension of their agreement for the joint research and development of advanced semiconductor technologies. The new 5-year agreement will focus on the continued advancement of technology for next-generation semiconductor nodes and architectures to power the age of generative AI. This agreement builds on a more than two-decade partnership between IBM and TEL for joint research and development. Previously, the two companies have achieved several breakthroughs, including the development of a new laser debonding process for producing 300 mm silicon chip wafers for 3D chip stacking technology. IBM and TEL are members of the Albany NanoTech Complex, the ecosystem for semiconductor research, owned and operated by NY CREATES.