GCT Semiconductor signs MOU with tier one telcom supplier, no terms

GCT Semiconductor Holding announced the execution of a memorandum of understanding MOU with a tier one worldwide infrastructure and terminal provider or the “Tier One Supplier” to collaborate on the development of Fixed Wireless Access,FWA, technology using GCT’s 5G solutions including modem chipset and RFIC. The company expects to close a definitive agreement before the end of 2024. “With the continued 5G network expansion around the globe, there is a strong demand for faster and high-performing FWA technology and 5G devices,” said John Schlaefer, CEO of GCT. “We are excited to continue our relationship with this key customer and look forward to working closely together as they roll out their 5G offering with GCT chipsets in 2025.” The MOU extends GCT’s existing relationship with this Tier One Supplier to include 5G chipsets, and collaboration on developing unique performance-enhancing features for FWA devices. The Company expects the launch of FWA devices related to this activity to commence in the second half of 2025.