Qnity, DuPont’s (DD) Electronics business, announced the signing of a Memorandum of Understanding with SK hynix, establishing a strategic long-term agreement for the supply of polishing pads for chemical mechanical planarization in semiconductor fabrication. The agreement supports SK hynix’s ongoing needs for advanced CMP pads, used for their next-generation semiconductor manufacturing and mass production processes. It reflects the continuation of a longstanding collaboration in enabling CMP materials for SK hynix’s growing memory business.
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