Coherent (COHR) announced its next-generation 300mm silicon carbide platform to address increasing thermal efficiency demands in AI datacenter infrastructure. Coherent has leveraged its 200mm platform to develop a next-generation 300mm solution, engineered to manage rising thermal loads. While datacenter thermal management applications are the primary focus of the platform, Coherent is also advancing its SiC technology for AR/VR devices and power electronics.
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