Citi believes Qualcomm (QCOM) may be evaluating Intel Foundry (INTC) for its data center application-specific integrated circuits business, which represents less than 1% of its sales. Citi found Qualcomm job postings with qualifications including Intel’s embedded multi-die interconnect bridge packaging technology, the analyst tells investors in a research note. The firm also found Apple (AAPL) and Broadcom (AVGO) job postings that include references to Intel’s packaging technology. Citi, which doubts the agreements would be material for Intel, points out the three potential contracts would be for packaging, which brings low pricing and margins. Citi keeps a Neutral rating on Qualcomm and Sell rating on Intel.
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