Celestica Inc. (CLS) and AMD (AMD) announced a strategic collaboration to bring the new “Helios” rack-scale AI platform to market. The collaboration pairs AMD computing leadership with Celestica’s expertise in delivering leading-edge networking switch technologies. At launch, Celestica will undertake the R&D, design and manufacturing of scale-up networking switches in the AMD “Helios” rack-scale AI architecture, based on the Open Compute Project, Open-Rack-Wide form-factor. The scale-up switches will utilize advanced networking silicon to enable the high-speed interconnect of the next-generation AMD Instinct MI450 Series GPUs, enabling leading-edge computing, optimized for large-scale AI clusters. Consistent with the open standards-based design of the “Helios” platform, the networking switches will utilize the Ultra Accelerator Link over Ethernet architecture for scale-up connectivity. AMD “Helios” will be available to customers in late 2026.
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