Broadcom ships 3.5D face-to-face compute SoC

Broadcom (AVGO) has begun shipping the industry’s first 2nm custom compute SoC built on its 3.5D eXtreme Dimension System in Package platform. A proven modular, multi-dimensional stacked die platform, 3.5D XDSiP combines 2.5D techniques and 3D-IC integration using Face-to-Face technology. 3.5D XDSiP is foundational to next-generation XPUs. With 3.5D XDSiP, consumer AI customers can deliver the most advanced XPU with unparalleled signal density, superior power efficiency and low latency to meet the massive computational demands of gigawatt-scale AI clusters. Broadcom’s XDSiP platform allows compute, memory and network I/O to scale independently in a compact form factor, enabling high-efficiency, low-power computing at scale.