Arteris announces expansion of multi-die solution

In a market reshaped by the compute demands of AI announced an expansion of its multi-die solution, delivering a foundational technology for rapid chiplet-based innovation. “In the chiplet era, the need for computational power increasingly exceeds what is available by traditional monolithic die designs,” said K. Charles Janac, president and CEO of Arteris (AIP). “Arteris is leading the transition into the chiplet era with standards-based, automated and silicon-proven solutions that enable seamless integration across IP cores, chiplets, and SoCs.”