Applied Materials, TSMC partner at EPIC Center to accelerate AI scaling

Applied Materials (AMAT) announced a new partnership with TSMC (TSM) to accelerate the development and commercialization of semiconductor technologies required for the next era of AI. Working together at Applied’s EPIC Center in Silicon Valley, the companies will co-innovate to advance materials engineering, equipment innovation, and process integration technologies designed to deliver performance from the data center to the edge. Through the EPIC Center engagement, Applied and TSMC will collaborate on materials engineering innovations. Areas of focus include: process technologies that enable continuous power, performance and area improvements across logic nodes, addressing the growing demands of AI and high-performance computing; new materials and next-generation manufacturing equipment enabling precise formation of increasingly complex 3D transistor and interconnect structures and advanced process integration approaches that improve yield, variability control and reliability as devices move toward vertically stacked and highly scaled architectures. Applied’s new, $5B EPIC Center in Silicon Valley represents the largest-ever U.S. investment in advanced semiconductor equipment R&D.