Applied Materials (AMAT) and CEA-Leti announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Under a memorandum of understanding, MOU,, the organizations plan to expand their joint lab and develop materials engineering solutions to address emerging infrastructure challenges in AI data centers. The joint lab is focused on device innovations for chipmakers serving ICAPS markets. These specialty chips are used in a wide range of applications – from industrial automation to electric vehicles – and they play a critical role managing data and power distribution within data centers. Under the new arrangement, Applied and CEA-Leti plan to expand the lab with new equipment and capabilities that move beyond individual process steps to include full-flow development of specialty devices.
Don’t Miss TipRanks’ Half-Year Sale
- Take advantage of TipRanks Premium at 50% off! Unlock powerful investing tools, advanced data, and expert analyst insights to help you invest with confidence.
- Make smarter investment decisions with TipRanks' Smart Investor Picks, delivered to your inbox every week.
Published first on TheFly – the ultimate source for real-time, market-moving breaking financial news. Try Now>>
Read More on AMAT:
- CrowdStrike and McDonald’s downgraded: Wall Street’s top analyst calls
- Morgan Stanley upgrades Applied Materials to Equal Weight on valuation
- Applied Materials upgraded to Equal Weight from Underweight at Morgan Stanley
- UnitedHealth, Matador, Air Canada, AutoZone, and Applied Materials: Trending by Analysts
- Applied Materials, Inc. Faces Financial Strain Amid Trade Policy Shifts and Tariff Challenges