Applied Materials (AMAT) and CEA-Leti announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Under a memorandum of understanding, MOU,, the organizations plan to expand their joint lab and develop materials engineering solutions to address emerging infrastructure challenges in AI data centers. The joint lab is focused on device innovations for chipmakers serving ICAPS markets. These specialty chips are used in a wide range of applications – from industrial automation to electric vehicles – and they play a critical role managing data and power distribution within data centers. Under the new arrangement, Applied and CEA-Leti plan to expand the lab with new equipment and capabilities that move beyond individual process steps to include full-flow development of specialty devices.
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