TF International analyst Ming-Chi Kuo said via X, formerly Twitter, that his latest industry checks on the Apple (AAPL)-Intel (INTC) partnership indicate that Apple has kicked off low-end/legacy iPhone, iPad, and Mac processors at Intel on the 18A-P series using Foveros packaging. “The order mix is roughly 80% iPhone, mirroring Apple’s end-device sales mix. Apple’s wafer plans at Intel reflect the technology lifecycle of the 18A-P series: small-scale testing in 2026, ramp in 2027, continued growth in 2028, and decline in 2029. Apple is also actively evaluating Intel’s other advanced-node technologies. Intel’s mass production timeline and shipment scale remain unclear, and assemblers/EMS have yet to see any shipment schedules. Intel’s 2027 yield target is to first stabilize at 50-60% or higher. Even if Intel’s initial shipments go smoothly, TSMC (TSM) will still retain over 90% of supply share.” The analyst says Apple is “systematically cultivating” Intel to become a long-term key supplier.
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