Adeia, UMC expand long-term collaboration in hybrid bonding technologies

Adeia (ADEA) announced that it has expanded and renewed its intellectual property licensing relationship with United Microelectronics Corporation, UMC, a leading global semiconductor foundry. The new agreement provides UMC with continued access to Adeia’s semiconductor portfolio, including hybrid bonding technologies, and extends the companies’ collaboration into future generations of 3D integration and advanced packaging solutions.