ACM Research (ACMR) has received multiple advanced packaging equipment orders from leading global semiconductor and technology customers. This includes orders for: Multiple wafer-level advanced packaging systems from a leading global OSAT customer based in Singapore, with deliveries scheduled for the first quarter of 2026; A panel-level advanced packaging vacuum cleaning tool from a leading global semiconductor packaging manufacturer based outside mainland China, also scheduled for delivery in the first quarter of 2026; and Multiple wafer-level advanced packaging systems from a leading North America-based technology customer, with deliveries scheduled for later this year.
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