A.O. Smith hires Ming Cheng as Chief Technology Officer

A. O. Smith announced that Ming Cheng will become A. O. Smith’s next SVP and Chief Technology Officer. He replaces Bob Heideman, who has been with the company in different capacities since 1994. Cheng, who was most recently SVP of R&D for the Transportation and Electronics Business Group at 3M Company, will join A. O. Smith July 7. Heideman will stay on through Sept. 1, to ensure a smooth transition. Cheng has worked for 3M for the past 25 years. During his time at 3M, Cheng served as VP of R&D in the Greater China area for four years.