3M (MMM) has joined the semiconductor packaging consortium JOINT3, an effort to bring together global leaders in semiconductor materials, equipment and design. JOINT3 is a co-creation evaluation platform established by Japan-based Resonac Corporation with the aim of accelerating the development of tools optimized for panel-level organic interposers, the thin layers made from organic materials that connect different parts of an electronic device, helping to manage electrical signals and power between components.
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