Tenstorrent Joins EU-Led CHASSIS Program to Advance Automotive Chiplet Platforms

New updates have been reported about Tenstorrent.

Tenstorrent has joined the three-year CHASSIS program, an EU-focused international R&D initiative aimed at developing chiplet-based hardware platforms for software-defined vehicles (SDVs), positioning the company more directly in the automotive semiconductor value chain. Working within a consortium of major automotive, semiconductor, and research organizations, Tenstorrent will design chiplet-based hardware architectures intended to deliver scalable, high-performance compute for SDVs, addressing the technical and cost limitations of traditional monolithic system-on-chips. For Tenstorrent, this involvement extends its RISC-V and AI compute roadmap into automotive-grade chiplet platforms, with potential long-term revenue opportunities in next-generation vehicle electronics.

The CHASSIS program targets standardization and industrialization of automotive chiplets, including alignment on die-to-die protocols, which could reduce per-wafer investment through volume scaling and improve reliability—factors critical for Tier 1 suppliers and OEM adoption. Tenstorrent’s Head of Autonomy, Thaddeus Fortenberry, highlighted that the initiative tackles both cost efficiency and quality via industry-wide collaboration, indicating strategic alignment with Tenstorrent’s modular chiplet and open-architecture strategy. Backed by the Chips Joint Undertaking and national funding from France, Germany, the Netherlands, and the UK, the program provides Tenstorrent with subsidized access to a European ecosystem focused on open chiplet platforms for automotive applications, potentially accelerating time-to-market, influencing emerging standards, and strengthening the company’s position as a supplier of AI and CPU chiplets for software-defined mobility.