According to a recent LinkedIn post from Omni Design Technologies, the company plans to showcase several advanced IP solutions at the TSMC 2026 North America Technology Symposium. The post highlights 3nm 224G PAM4 / 64G NRZ silicon photonics TIA and driver IP, a 3nm 64 GS/s ADC IP aimed at high-speed AI data center infrastructure, and 16nm 16G UCIe IP for high-bandwidth die-to-die connectivity.
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The post also points to broader chiplet and “droplet” system-level design engagements, suggesting a move up the value chain from individual IP blocks toward more complete end-to-end solutions. For investors, this emphasis on AI data center connectivity and chiplet-based architectures could indicate an effort to align with one of the fastest-growing segments in semiconductor demand.
As shared in the post, management characterizes the past year as a “milestone” period, noting that the company is extending its experience in terrestrial broadband, wireless communications, and ADAS into data center connectivity. If these offerings gain traction with hyperscale and networking customers, Omni Design Technologies could see expanding design-win pipelines and potentially higher-margin opportunities over time.
The focus on 3nm and high-speed interconnect technologies positions the company alongside key industry trends such as AI scale-out networking and chiplet-based system design. While commercial outcomes and revenue impact are not disclosed in the post, the technology roadmap outlined suggests that Omni Design Technologies is targeting long-term participation in next-generation data center and advanced packaging ecosystems.