According to a recent LinkedIn post from Omni Design Technologies, the company is engaging with customers and partners at TSMC Technology Symposiums across multiple regions in 2026. The post notes planned participation in events in Taiwan, Europe, China, and Japan, where the firm intends to showcase several advanced IP offerings.
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The company’s LinkedIn post highlights 3nm 224G PAM4 / 64G NRZ silicon photonics TIA and driver IP aimed at AI-era network scale, along with a 3nm 64 GS/s ADC IP targeting high-speed AI data center infrastructure. The post also references 16nm 16G UCIe IP for high-bandwidth die-to-die connectivity and broader chiplet and “droplet” solution engagements.
For investors, the post suggests Omni Design Technologies is positioning its mixed-signal and analog IP portfolio around AI data centers and chiplet-based architectures, which are key growth themes in semiconductors. Active presence at TSMC ecosystem events may enhance visibility with leading-edge customers, potentially supporting design-win momentum and longer-term licensing revenue opportunities.