According to a recent LinkedIn post from Interlace, the company plans to participate in the Hong Kong Web3 Festival, where it intends to showcase its latest product and engage with the Web3 community. The post highlights Interlace’s presence at two April 20 events: The Scaling Summit: House of AI and a session on RWA & Payments focused on tokenized assets and on-chain payment infrastructure.
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For investors, this activity suggests Interlace is positioning itself within emerging segments of digital payments, including tokenized real-world assets and AI-enabled payment solutions. Visibility at a major regional Web3 event could help the company build partnerships, test market interest for its product offering, and potentially accelerate business development in on-chain payment infrastructure.