According to a recent LinkedIn post from Interlace, the company plans to participate in the Hong Kong Web3 Festival, where it expects to showcase its latest product and engage with the broader Web3 community. The post highlights Interlace’s presence at two April 20 events focused on AI, tokenized assets, and on-chain payment infrastructure, including the Scaling Summit: House of AI and a session on RWA & Payments.
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The post suggests that Interlace is positioning itself within the emerging on-chain and digital payments ecosystem, emphasizing themes such as “agentic” and AI-enabled payments. For investors, this visibility at a major regional Web3 forum could indicate an effort to build partnerships, validate product-market fit, and increase brand recognition in the fast-developing tokenized assets and payment infrastructure space, though no specific commercial milestones or financial metrics are referenced.