Forge Nano Expands Asian Footprint as ALD Breakthrough Aligns With SPAC-Backed IPO Plan

New updates have been reported about Forge Nano.

Forge Nano, Inc., a U.S. semiconductor equipment and advanced materials company, is stepping up its Asia strategy with a technical seminar in Kuala Lumpur, Malaysia on May 6 to showcase its Atomic Layer Deposition coatings for AI-era chip manufacturing. The event targets manufacturers in a country that now accounts for roughly 13% of global semiconductor assembly, testing and packaging, as Forge Nano seeks to embed its tools in a key regional production hub.

The seminar follows a recent technical milestone in which Forge Nano demonstrated high-speed ALD coatings on production-representative wafers from C2MI, achieving uniform coverage on structures with aspect ratios up to 1000:1, a level that challenges conventional deposition methods. This capability positions the company to support next-generation architectures in advanced packaging, memory and photonics, where increasingly complex 3D geometries demand precise, scalable deposition.

Forge Nano is building a production-ready ecosystem across Asia with local partnerships, service infrastructure and supply chain support, aiming to become a long-term manufacturing partner rather than a pure equipment vendor. Management frames this localized support model as critical as chipmakers confront manufacturing bottlenecks driven by surging demand for AI, high-performance computing and photonics.

Strategically, these technical and regional moves come as Forge Nano advances a planned public listing through its merger agreement with Archimedes Tech SPAC Partners II Co., which implies a pre-money, pre-merger valuation of about $1.2 billion. The transaction, expected to close in the second half of 2026, would list Forge Nano on Nasdaq under the ticker “NANO,” potentially providing capital and public-market visibility to scale its ALD platform across global semiconductor and defense battery applications.