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Towa Corporation ( (JP:6315) ) has issued an announcement.
Towa Corporation has developed a new packaging technology called Ultra narrow gap Mold Underfill, designed to enhance semiconductor packaging for next-generation HBM4 semiconductors used in generative AI. This technology allows for improved stacking of semiconductor chips, increasing productivity and quality in manufacturing processes, and is set to be implemented in new equipment with sales beginning in August.
More about Towa Corporation
Towa Corporation operates in the semiconductor industry, focusing on advanced semiconductor packaging technologies. The company is known for its innovative compression technology, which addresses challenges in semiconductor manufacturing processes, particularly in the context of generative AI applications.
YTD Price Performance: 0.54%
Average Trading Volume: 396
Technical Sentiment Consensus Rating: Hold
Current Market Cap: €714.2M
For detailed information about 6315 stock, go to TipRanks’ Stock Analysis page.