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Paras Defence to Form Semiconductor Packaging Subsidiary Focused on AI and HPC

Story Highlights
  • Paras Defence will incorporate Paras Semiconductors as a wholly owned subsidiary with ₹10 lakh capital.
  • The new unit will build advanced 3D semiconductor packaging OSAT for AI, HPC and data centers, broadening Paras’s tech footprint.
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Paras Defence to Form Semiconductor Packaging Subsidiary Focused on AI and HPC

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The latest announcement is out from Paras Defence & Space Technologies Ltd. ( (IN:PARAS) ).

Paras Defence & Space Technologies Ltd. has approved the incorporation of a new wholly owned subsidiary, Paras Semiconductors Private Limited, with an authorised and paid-up share capital of ₹10 lakh. The subsidiary will operate in the semiconductor industry and is being formed to establish a state-of-the-art advanced heterogeneous packaging and 3D packaging OSAT (Outsourced Semiconductor Assembly and Testing) facility, targeting AI, high-performance computing, networking and data centre applications. This move signals Paras Defence’s strategic diversification into semiconductor packaging, potentially strengthening its position in high-tech manufacturing, aligning it with growing domestic and global demand for advanced chip packaging services, and broadening its relevance across defence, data infrastructure and next-generation computing ecosystems.

More about Paras Defence & Space Technologies Ltd.

Paras Defence & Space Technologies Ltd. operates in the defence and space technology sector, supplying advanced engineering solutions and products to strategic industries. The company focuses on high-precision defence and space applications, and is increasingly aligning itself with high-technology domains such as semiconductors and electronics to deepen its role in critical infrastructure and national security supply chains.

Average Trading Volume: 66,884

Technical Sentiment Signal: Buy

Current Market Cap: 53.38B INR

See more insights into PARAS stock on TipRanks’ Stock Analysis page.

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