Mold-Tek Packaging Sets Board Meet to Consider First Interim Dividend and Fixes Record Date

Mold Tek Packaging Ltd ( (IN:MOLDTKPAC) ) has issued an announcement.

Mold-Tek Packaging has scheduled a board meeting on April 20, 2026 to consider the declaration of a first interim dividend for the financial year 2025-26. The company has set April 24, 2026 as the record date to determine shareholder eligibility for the interim dividend, and confirmed that its trading window remains closed from April 1, 2026 until 48 hours after the announcement of audited financial results for the year ended March 31, 2026.

These steps signal routine corporate governance and capital allocation planning, with the potential dividend decision and trading window closure aligning with regulatory requirements under SEBI listing regulations. Investors and other stakeholders will be watching the upcoming board meeting and subsequent financial results for indications of the company’s performance and any distribution of returns to shareholders.

More about Mold Tek Packaging Ltd

Mold-Tek Packaging Limited operates in the packaging industry, focusing on manufacturing and supplying packaging solutions from its base in Hyderabad, Telangana. The company is listed on both BSE and the National Stock Exchange of India under the symbol MOLDTKPAC, indicating its presence in India’s public capital markets.

Average Trading Volume: 5,361

Technical Sentiment Signal: Sell

Current Market Cap: 17.68B INR

See more insights into MOLDTKPAC stock on TipRanks’ Stock Analysis page.