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IZMO Limited ( (IN:IZMO) ) has issued an update.
IZMO Limited announced that its izmo Microsystems division has designed a high-complexity 3D System-in-Package module for space payload camera electronics, shrinking a traditional 200 mm × 200 mm PCB design into an 81 mm × 81 mm SiP and achieving an 84% reduction in footprint. Built using stacked substrates, high-density wire bonding and a fully indigenized hermetic ceramic package engineered in India, the solution delivers space-grade reliability and robustness while reducing dependence on restricted foreign technologies, positioning the company among a select group of global players in advanced 3D heterogeneous integration for space applications and strengthening India’s sovereign base for future Silicon Photonics and Quantum Communications.
More about IZMO Limited
IZMO Limited, through its specialized division izmo Microsystems, operates in the advanced semiconductor and electronic packaging space, focusing on high-complexity 3D System-in-Package (SiP) solutions. The company is targeting demanding applications such as space payload camera electronics, aligning its capabilities with India’s broader semiconductor mission and the “Make in India” initiative by developing indigenized, space-grade packaging technologies.
Average Trading Volume: 9,985
Technical Sentiment Signal: Buy
Current Market Cap: 10.63B INR
Learn more about IZMO stock on TipRanks’ Stock Analysis page.