Hong Kong Aerospace Tech Launches HK$100 Million Bond Offering
Company Announcements

Hong Kong Aerospace Tech Launches HK$100 Million Bond Offering

Hong Kong Aerospace Technology Group Limited (HK:1725) has released an update.

Hong Kong Aerospace Technology Group Limited has announced a bond placement agreement with Geo Securities Limited to raise up to HK$100 million. The bonds, aimed at professional investors and independent third parties, will be issued at their full principal value over a six-month period. The placing agent will receive a 10% commission on successfully placed bonds, reflecting market conditions and negotiation outcomes.

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